Coating thickness measurement gauge for connectors - XDLM237 is engineered using best available techniques and following international industrial standard. These are X-ray fluorescence measuring instrument for manual or automated coating thickness measurements and analysis on PC-boards, electronics components and mass-produced parts, even on small structures. These are widely used for the measurement and analysis of thin coatings, even at small concentrations. These are acclaimed for its effective usage and longer service life.
XDLM 231: Plane support stage, motor-driven Z-axis
XDLM 232: Manually operable XY-stage, motor-driven Z-axis
XDLM 237: Motor-driven XY-stage that moves into the loading position automatically, when the protective hood is opened. Motor-driven programmable Z-axis
Measurement of electroplated mass-produced parts
Inspection of thin coatings, e.g., decorative chromium-plating
Analysis of functional coatings in the electronics and semiconductor industries
Automated measurements, e.g., on printed circuit boards
Intended use:Energy dispersive X-ray fluorescence measuring instrument (EDXRF)
to determine thin coatings and alloys.
Element range:Aluminum Al (13) to Uranium U (92) – up to 24 elements simultaneously.
Design:Bench-top unit with hood opening upwards
XY-stage and Z-axis electrically driven and programmable
Motor-driven changeable apertures and filters
Video camera and laser pointer (class 1) for orienting the sample
Measuring direction:Top down
X-ray tube:Micro focus tungsten tube with beryllium window
High voltage:Three steps 10 kV, 30 kV, 50 kV
Aperture (Collimator):4x changeable: Ø 0.1 mm (3.9 mils), Ø 0.3 mm (11.8 mils), Ø 0.6 mm
(23.6 mils) slot 0.5 x 0.15 mm (19.7 x 5.9 mils), others on request
Primary filter:3x changeable (Standard configuration: Nickel, Aluminum, no filter)
Measurement spot:Depending on the measuring distance and on the aperture, the actual
measurement spot size is shown in the video image. Smallest measurement
approx. Ø 0.15 mm (5.9 mils) with aperture 0.1 mm (3.9 mils)
X-ray detector:Silicon PIN detector with peltier cooling
Resolution (fwhm for Mn-Kα):≤ 200 eV
Measurement distance:0 … 80 mm (0 … 3.2 in) Distance compensation with patented DCM method
for simplified measurements at varying distances. For particular applications
or for higher demands on accuracy an additional calibration might be
necessary.
Video microscope:High-resolution CCD color camera for optical monitoring of the
measurement location along the primary beam axis,manual focusing
and auto-focus, crosshairs with a calibrated scale (ruler) and spot-
indicator,adjustable LED illumination, laser pointer (class 1)
to support accurate sample placement.
Zoom factor:Digital 1x, 2x, 3x, 4x
Design: Programmable, motor-driven XY-stage
Maximum travel: X/Y-axis: 255 x 235 mm (10 x 9 in); Z-axis: 140 mm (5 in)
Max. travel speed: 80 mm/s (3.2 in/s)
Repeatability precision XY: ≤ 0.01 mm (0.4 mils), unidirectional
Usable sample Width x depth [mm]: 300 x 350 mm, [in]: 12 x 14
placement area:
Max. sample weight: 5 kg, with reduced approach travel precision 20 kg
Max. sample height: 140 mm (5.5 in)
Power supply:AC 115 V or AC 230 V 50 / 60 Hz
Power consumption:Max. 120 W ,without evaluation PC
Protection class:IP40
External dimensions
Width x depth x height [mm]:570 x 760 x 650 mm, [in]: 22 x 30 x 26
Interior dimensions460 x 495 x 146 mm, [in]: 18 x 19.5 x 5.7
Width x depth x height [mm]:
measurement chamber
Weight:Approx. 115 kg (52 lb)
Temperature: Operation:10 °C – 40 °C / 50 °F – 104 °F
Temperature0 °C – 50 °C / 32 °F – 122 °F
Storage/Transport:
Admissible air humidity:≤ 95 %, non-condensing
Computer:Windows®-PC
Software:Standard: Fischer WinFTM® BASIC including PDM®,
Optional: Fischer WinFTM® SUPER
CE approval:EN 61010
X-Ray standards:DIN ISO 3497 and ASTM B 568
Approval:Fully protected instrument with type approval according to the German
regulations "Deutsche Röntgenverordnung-RöV".
Download PDF